Why use SMT surface mount technology and the technical characteristics of SMT

SMT is surface mount technology (Surface Mounted Technology) (abbreviation for Surface Mounted Technology), and it is the most popular technology and process in the electronics assembly industry.

SMT is a kind of surface mount components with no leads or short leads (SMC/SMD for short, chip components in Chinese) mounted on the surface of PCB or other substrates, and soldered by reflow soldering or dip soldering. Assembled circuit assembly technology.

Why use SMT surface mount technology?
1. Electronic products are pursuing miniaturization. The previously used perforated plug-in components can no longer be reduced, and electronic products have more complete functions. The integrated circuits (IC) used no longer have perforated components, especially large-scale, highly integrated ICs, so they have to use surface SMD component products are mass-produced and automated. The factory must produce high-quality products at low cost and high output to meet customer needs and strengthen market competitiveness.
2. The development of electronic components, the development of integrated circuits (IC), the diversified application of semiconductor materials, and the electronic technology revolution are imperative to follow the international trend.

Technical characteristics of SMT:
1. High assembly density, small size and light weight of electronic products. The volume and weight of chip components are only about 1/10 of that of traditional plug-in components. Generally, after SMT PCB assembly is adopted, the volume of electronic products will shrink by 40%~60% and the weight will be reduced by 60%. %~80%.
2. High reliability and strong anti-vibration ability. The defect rate of solder joints is low.
3. Good high frequency characteristics. Reduce electromagnetic and radio frequency interference.
4. It is easy to realize automation and improve production efficiency. Reduce costs by 30%~50%. Save materials, energy, equipment, manpower, time, etc.

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